Boom Stands are used for holding the thermal head in a fixed position while the device plunger contacts the device;
they are suitable for testing soldered devices, devices in open top sockets, and devices in sockets with Open Frame Tthermal Lids. The Boom Stand mechanism includes a Frost Preventing Manifold that prevents frost and humidity creation in both Z up and Z down positions. The Boom Stand easily interface the device plunger to DUTs on any given test board.
For more information visit our NPA at Support page