MaxTC Power Plus

MaxTC Power Plus was designed with high power and flexibility in mind, allowing for customization to suit different package and interface variations. The system allows for forcing temperature across a wide range of high power device sizes and types, whether socketed or soldered to board. With state of the art design and technology the Max TC Power Plus unit stimulates DUT to the desired temperature precisely and consistency by direct contact with a powerful thermal head.

MaxTC high power temperature forcing system

Features

Fast time to stable temperature (Tcase)
Short stabilizing soak time and overshooting.
Temperature stability: ±0.5°C
Condensation FREE at cold test
Maintenance FREE system
Fully programmable:available drivers LABVIEW, MATLAB, VB, C++, C#, Python….
PID overshooting control
Stand-alone plug and play system
No external chiller or compressed air is required
Software controlled transition rates to eliminate thermal shock
Suitable for testing any socketed and soldered DUT up to 100mm size.
Environmentally friendly operation
ESD safe product
Min and Max temperature safety lock
Thermal stream/chamber/chiller replacement
High Reliability Testing
ATE, SLT and Bench

MaxTC power plus Datasheet

MaxTC Cooling Power Plus

integrated

Robust and small footprint
Setup is very fast and convenient using the clip connects.
Precise and consistent force, contact and thermal conductivity.
Touch screen for accurate actuating force control in Kgf, (remote controlled)
Fast and simple to attach and detach the thermal head using the clip connect.
Adaptable for variety of soldered and socketed devices Compressed air supply is ONLY required. (80PSI maximum, 4mm air pipe hose)
Ideal for bench testing, ATE and productive test engineering

User Interface

Operations by a smart controller which is accessed through a 7″ color touch-screen with an extensive menu.

All system interface can be remotely controlled via LAN.

max-tc main screen

max-tc system settings

Thermal control unit

Cooling Power -40°C@400W (steady state)
Ramp Rate up to 120C/Min
Temperature stability: ±0.5°C
Temperature Range -75°C to +200°C
Minor temperature overshooting at high power spikes
Fast recovery time at high power spikes
Replace LN2, Thermostream, Chillers and Chambers
Remote controlled

Specifications

System General
Temperature Range	-75°C to +200°C
Temperature Accuracy	±0.5°C
Typical Transition Rates	Up to 120°C/min (ramp rate controllable)
Temperature Sensor	Type K Thermocouple Ports, Thermal Diode K-type thermocouple
DUT Dimensions	Up to 100mm

Mechanical Dimensions
System Enclosure mm / inch	(L) 555mm x (W) 45 mm x (H) 30 mm (L) 21.8” x (W) 17.7” x (H) 11.8”
System Weight	~65 kg
Thermal Head Size (WxHxD)	Square type: 73mmx73mmx40mm
Thermal Head Weight	~1.5kg
Thermal Head Hose	~2-meter (6.5ft) Head Distance

Facilities Requirements
Electrical	208-240VAC, 50/60Hz, 20A
Operating Temp.	10°C to 30°C (non–condensing)
Plug	NEMA L6-20/30
*Compressed Dry Air	<.0.5cfm @90psi (-40°C dew point)

Data/Communications
USB	Type B
Ethernet TCP/IP	RJ-45
Touch Screen Display	7” LCD

requires only

C Input; MaxTC: 208-240 VAC; 1~ 50Hz /60Hz 20A;
Plug Type: NEMA L6-20 or 30
Clean dry air or nitrogen for condensation free operation during cold testing.