MaxTC Power Plus

MaxTC Power Plus was designed with high power and flexibility in mind, allowing for customization to suit different package and interface variations. The system allows for forcing temperature across a wide range of high power device sizes and types, whether socketed or soldered to board. With state of the art design and technology the Max TC Power Plus unit stimulates DUT to the desired temperature precisely and consistency by direct contact with a powerful thermal head.

MaxTC high power temperature forcing system
Features
  • Fast time to stable temperature (Tcase)
  • Short stabilizing soak time and overshooting.
  • Temperature stability: ±0.5°C
  • Condensation FREE at cold test
  • Maintenance FREE system
  • Fully programmable:available drivers LABVIEW, MATLAB, VB, C++, C#, Python….
  • PID overshooting control
  • Stand-alone plug and play system
  • No external chiller or compressed air is required
  • Software controlled transition rates to eliminate thermal shock
  • Suitable for testing any socketed and soldered DUT up to 100mm size.
  • Environmentally friendly operation
  • ESD safe product
  • Min and Max temperature safety lock
  • Thermal stream/chamber/chiller replacement
  • High Reliability Testing
  • ATE, SLT and Bench
MaxTC Cooling Power Plus
integrated
  • Robust and small footprint
  • Setup is very fast and convenient using the clip connects.
  • Precise and consistent force, contact and thermal conductivity.
  • Touch screen for accurate actuating force control in Kgf, (remote controlled)
  • Fast and simple to attach and detach the thermal head using the clip connect.
  • Adaptable for variety of soldered and socketed devices Compressed air supply is ONLY required. (80PSI maximum, 4mm air pipe hose)
  • Ideal for bench testing, ATE and productive test engineering
User Interface

Operations by a smart controller which is accessed through a 7″ color touch-screen with an extensive menu.

All system interface can be remotely controlled via LAN.

max-tc main screen

max-tc profile screen

max-tc system settings

Thermal control unit
  • Cooling Power -40°C@400W (steady state)
  • Ramp Rate up to 120C/Min
  • Temperature stability: ±0.5°C
  • Temperature Range -75°C to +200°C
  • Minor temperature overshooting at high power spikes
  • Fast recovery time at high power spikes
  • Replace LN2, Thermostream, Chillers and Chambers
  • Remote controlled
Specifications

System General 
Temperature Range-75°C to +200°C
Temperature Accuracy±0.5°C
Typical Transition RatesUp to 120°C/min (ramp rate controllable)
Temperature SensorType K Thermocouple Ports,
Thermal Diode
K-type thermocouple
DUT DimensionsUp to 100mm

Mechanical Dimensions 
System Enclosure mm / inch(L) 555mm x (W) 45 mm x (H) 30 mm
(L) 21.8” x (W) 17.7” x (H) 11.8”
System Weight~65 kg
Thermal Head Size (WxHxD)Square type: 73mmx73mmx40mm
Thermal Head Weight~1.5kg
Thermal Head Hose~2-meter (6.5ft) Head Distance

Facilities Requirements 
Electrical208-240VAC, 50/60Hz, 20A
Operating Temp.10°C to 30°C (non–condensing)
PlugNEMA L6-20/30
*Compressed Dry Air<.0.5cfm @90psi (-40°C dew point)

Data/Communications 
USBType B
Ethernet TCP/IPRJ-45
Touch Screen Display7” LCD

requires only

C Input; MaxTC: 208-240 VAC; 1~ 50Hz /60Hz 20A;
Plug Type: NEMA L6-20 or 30
Clean dry air or nitrogen for condensation free operation during cold testing.