DIRECT CONTACT THERMAL CONTROL SOLUTIONS

PRECISION THERMAL CONTROL FOR
EXTREME PERFORMANCE

Pioneering Thermal Testing with Patented Direct contact Technology
& Power Dissipation Versatility

Wide range of Thermal Forcing Systems

Mechanical Devices (MD) – Advanced Thermal Forcing Systems for Semiconductor Test
Mechanical Devices is a global leader in thermal forcing systems and temperature control units (TCUs) for semiconductor IC testing, characterization, and validation. We design and manufacture direct-contact thermal solutions that deliver fast, accurate, and stable temperature control across the full test temperature range – engineered specifically for the demands of chip developers, validation engineers, and test labs.

Purpose-built for IC test engineers
Our thermal forcing units – Flex TC, Max TC, ECO Cool, Power Plus, Multizone & Top Cool Series  – set the benchmark for precision thermal conditioning in semiconductor test environments. Each system is built to address the real-world bottlenecks engineers face: faster transition times, tighter temperature stability, higher power handling, and lower cost of test.

Whether you’re characterizing a new SOC, validating ASIC performance over temperature, or running production-grade thermal screens, MD’s TCU’S deliver the repeatability and throughput modern device testing demands.

Seamless integration across your test ecosystem
MD thermal control units integrate directly with bench characterization setups, ATE (automated test equipment) platforms, and SLT (system-level test) environments – giving engineering teams a single thermal solution that scales from R&D to high-volume manufacturing.

Trusted by the world’s leading semiconductor manufacturers
MD’s end-user customers include top-tier IDMs, fabless chip designers, and OEMs. Our technology is helping semiconductor manufacturers improve test accuracy, increase test cell efficiency, and protect margins as device complexity and power densities continue to climb.

Global presence, local support
Headquartered in Haifa Bay, Israel, with a US office in Santa Clara, California, and a network of sales and technical representatives across the North-America, EMEA, and APAC – MD is positioned to support semiconductor test global programs wherever they run.

 

Find the right Thermal Solution for your test application.
Talk to our thermal engineers

CONTACT US

OUR PRODUCTS

top COOL 1000

top COOL 1000

High-Power Thermal Control Unit

Designed for precise temperature control of high power devices, rapid temperature changes, cover the widest working temperature of -70°C to +200°C with utmost cooling and heating capacity -40°C@1000W.
Works great for all kinds of Packages or modules up to 120 mm.

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-70°C

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+200°C

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Up to 1500W

MULTIZONE

MULTIZONE

CONTROL UNIT

Introducing the PowerPlus MultiZone Operational Thermal Forcing Unit.

  • Designed for precise and fast temperature control
  • Up to 6 thermal zones controlled independently
  • Maximum temperature difference of 60°C between cores
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-60°C

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+150°C

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-40C @ 100W

MaxTC power plus

MaxTC
POWER PLUS

Designed for Precise temperature control of high power devices, rapid temperature changes, cover the widest working temperature of -75C to + 200C with utmost cooling and heating capacity of -40C@400W. works great for all kinds of packages or modules up to 120mm.

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-75°C

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+200°C

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-40C @ 400W

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Precision Thermal Testing 
is not just a technical need
it’s a strategic advantage.

Precision Thermal Testing is not just a technical need
it’s a strategic advantage.

  • Thermal range: −75°C to +200°C
  • Power dissipation: up to 1500W Soon 3000W
  • DUT Thermal Diode Feedback
  • Reaching T-junction and not only the T-case
  • Small keep out area.
  • Heat/Cool without affecting the surrounding components.
  • Plug-and-play operation
  • Applications: Bench, ATE, SLT & OEM Integrations
  • Thermalstream, Chamber, & Chiller replacements
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