MaxTC POWER PLUS MULTIZONE

The Mechanical Devices MaxTC Power Plus MultiZone is a direct-contact thermal forcing system that independently controls up to six temperature zones on one semiconductor device. It is designed for advanced ICs containing multiple cores, chiplets, dies, or thermal areas.

A MultiZone thermal forcing system applies and controls different temperatures across separate areas of the same device under test (DUT). Each zone can run its own temperature cycle and use an individual DUT thermal-feedback loop.

The Power Plus MultiZone can independently control up to six thermal zones. Each zone can have its own temperature setpoint, transition rate, soak time, control parameters, and thermal-feedback loop.

Independent multi-zone control allows engineers to create different thermal conditions across a complex semiconductor package. This is useful for testing devices with multiple dies, cores, chiplets, hotspots, and functional areas under realistic operating conditions.

The system operates across a temperature range of -60°C to +150°C, supporting cold, ambient, and high-temperature semiconductor testing.

The Power Plus MultiZone supports a maximum temperature difference of 60°C between thermal zones, allowing different areas of the same DUT to be tested simultaneously at different temperatures.

The customized MultiZone tip provides cooling performance of -40°C at 100W Tc, according to the specified operating conditions.

The system provides temperature accuracy of ±0.2°C and temperature stability of 0.2°C, supporting precise and repeatable semiconductor characterization, validation, and reliability testing.

The Power Plus MultiZone supports programmable temperature transition rates of up to 75°C per minute, helping engineers perform fast and controlled thermal cycles.

A customized direct-contact MultiZone tip is positioned against the DUT using a pneumatic clip-on actuator. Each thermal zone can use sensing or DUT thermal-diode feedback to control its temperature precisely and consistently.