System Overview

The FlexTC/ MaxTC Thermal Head contains the Plunger that transmits the temperature to the DUT. The Plunger, when the Thermal Head interfaces on the DUT, is in direct contact with the chip being tested. In this way temperature is passed by direct conduction between the Plunger and the chip.

The Plunger contains a thermal sensor (PT100) which makes 30 measurements per second. The sensor data is passed to the system which, in turn, makes 30 thermal corrections within a second, Actively Heating and Cooling the plunger to guarantee the ±0.2°C accuracy on the DUT.

The Thermal Head also has four purge nozzles for the introduction of nitrogen or dry air to the testing area, access line is connected to the unit’s back panel. The constant nitrogen or dry air flow creates a frost and humidity free shield around the DUT. For additional Flexibility the system can be controlled remotely through the ethernet communication port.

Some Applications of need Temperature Forcing systems:

  • Back-End Test
  • Cooling the IC while Stress Full Cycle
  • IC Handler Verification
  • Incoming Inspection
  • Functional Test
  • Failure Analysis
  • Final Test
  • Product Engineering
Mechanical Devices - Thermal forcing systems for temperature testing semiconductor IC

Benefits of Fluid-Free Operation

FlexTC/ MaxTC are Fluid Free – the systems do not contain any fluids and it do not require external chillers for their operation.
FlexTC/ MaxTC are self-contained standalone systems that completely eliminate the need for chillers. Chiller-based systems always run the risk of fluid leaks that can cause severe damage to the tester. FlexTC/ MaxTC in that they are fluid free means that their thermal head operates safely on tester heads without risks of spills or leaks.