Home | Applications | Soldered Application Solution
Key application points
- Soldered DUTs and open-top sockets
- Types of soldered ICs on PCB: SOP/SOIC, QFN/DFN, QFP/TQFP, BGA/LGA, CSP/WLCSP, SOT/TO and other flat-top packages
- No controlled Kgf required — apply stable contact to the package
- Boom stand recommended for small packages up to 40 mm
- Larger packages: use toggle or clip-on actuator for stable contact
- Match plunger / tip geometry to the package surface
Before final configuration – ask for consultation
- Contact our team for an application review before finalizing the setup
- Share DUT/module dimensions, max power dissipation, target temperature range, and case/junction control preference
- Confirm CDA / dry-air availability and any mechanical constraints around the DUT
Recommended solution stack
- TCU system + axial or right-head thermal head
- Boom stand: stand or clip configuration
- Custom plunger / tip for direct thermal path
- TIM / thermal pad as needed
- Optional purge cup and custom backside cover for cold testing
Need help choosing the right solution?
Ask for a consultation from our application team for the best soldered or socketed setup.