Toggle solution air free & pneumatic free

SOLDERED APPLICATIONS

Best for:

• Open top / direct-contact testing
• No pneumatic force required for small packages
• Larger packages can use stable manual toggle force

Suitable soldered ICs on PCB:

• QFN / DFN / LGA / BGA
• QFP / TQFP / PQFP
• SOP / SOIC / SSOP / TSSOP / TSOP
• Discrete devices and small modules

Key advantage:
Air-free, simple, quiet, and reliable thermal contact for validation, characterization, and engineering use.

SOCKETED APPLICATIONS

Best for:

• Open top sockets with light contact or no force
• Closed top sockets requiring manual, repeatable force
• Engineering validation, burn-in and functional test

Suitable socketed devices:

• High pin-count ICs in test sockets
• Processors, ASICs, FPGAs, and chipsets
• Optics / transceivers and specialty modules

Key advantage:

Consistent contact pressure without compressed air, offering a clean and low-maintenance solution.