Home | Applications | Socketed Application Solution
Key application points
- Socketed ICs and closed-top test sockets
- Types of socketed IC packages: BGA/LGA, QFN/DFN, QFP/TQFP, SOP/SOIC, CSP/WLCSP, SOT/TO and custom modules
- Precise Kgf applied through the plunger/tip for reliable thermal contact
- Clip-on actuator provides controlled constant force up to 80 Kgf
- Larger packages / high-force needs: high-Kgf actuator option up to 300 Kgf
- Purge air is required for actuator operation and cold-test condensation control
Before final configuration – ask for consultation
- Contact our team for a socket/application review before finalizing the setup
- Share socket type, package outline, DUT dimensions, target force, max power dissipation, target temperature range and Tcase/Tjunction control preference
- Confirm CDA / dry-air, pneumatic air availability, socket keep-out, adapter mounting and mechanical clearance around the DUT
Recommended solution stack
- TCU system + axial or right-head thermal head
- Custom plunger / tip matched to package outline and socket access
- Clip-on actuator + clip-on adapter + adapter plate
- Optional boom stand for alignment and support
- Optional custom backside cover for condensation prevention
- Optional TIM / thermal pad where applicable
Need help choosing the right solution?
Ask for a consultation from our application team for the best soldered or socketed setup.