MaxTC POWER PLUS HIGH-POWER
High Power THermal Control Unit
The MD Thermal Control Units are designed for high efficiency and flexibility, allowing customization for various package types and interfaces. These systems provide precise temperature control for a wide range of device sizes and configurations, whether socketed or soldered to the board. Using advanced technology, the MD units maintain accurate and consistent temperature control by directly contacting the Device Under Test (DUT) with the thermal head tip.
The proven thermal head method ensures stable temperature regulation at the point of contact. The pneumatically-driven thermal head directly contacts the IC device, delivering excellent power handling and precise temperature control.
The Power Plus series offers key upgrades, including an extended temperature range, lower current consumption, reduced noise, lower air temperature emission, and improved cooling power.
The Mechanical Devices MaxTC Power Plus is a high-power thermal control unit for precise temperature testing of semiconductor devices. It uses direct-contact heating and cooling to control the case or junction temperature of high-power devices, including AI and HPC processors.
The MaxTC Power Plus operates across a wide temperature range of -75°C to +200°C, enabling cold, ambient, and high-temperature semiconductor testing.
The MaxTC Power Plus delivers cooling performance of -40°C at 400 W Tc and can maintain approximately 0°C at 700W Tc, subject to the complete thermal load and test configuration.
Yes. Its high cooling capacity and direct-contact thermal head make the MaxTC Power Plus suitable for testing AI processors, HPC devices, server components, accelerators, and other high-power semiconductor packages.
A pneumatic thermal head places a customized tip in direct contact with the device under test (DUT). This contact transfers heating or cooling directly to the device, providing stable pressure and precise temperature regulation.
Direct-contact temperature testing controls a semiconductor device by placing a thermally regulated tip directly against its surface. This approach concentrates the heating and cooling at the DUT and avoids the need to condition an entire chamber.
The MaxTC Power Plus is available with 55 mm and 75 mm thermal heads. Customized contact tips can support semiconductor packages ranging from approximately 5 mm to 119 mm.
Yes. Mechanical Devices can customize the thermal tip to match the DUT’s package dimensions, contact area, socket, PCB configuration, and thermal requirements.
Yes. The system can be adapted for semiconductor devices installed in test sockets or soldered directly to a printed circuit board.
The MaxTC Power Plus provides temperature accuracy of ±0.2°C and temperature stability of 0.2°C, supporting repeatable characterization, validation, and reliability testing.
The system supports programmable temperature transition rates of up to 75°C per minute, helping reduce thermal cycling and device test time.
The MaxTC Power Plus supports:
- PT100 temperature sensors
- Thermocouple feedback
- DUT thermal-diode feedback
Its programmable thermal-feedback loop allows the control method to be matched to the device and application.
The pneumatic clip-on actuator provides an adjustable actuation force from 30 to 350 kgf, helping maintain stable and repeatable contact between the thermal tip and DUT.
Available configuration options include:
- Pneumatic clip-on actuator
- Manual actuator
- Toggle clamp
- Boom stand
- Customized fixtures
- Protective enclosures
Yes. It is a self-contained, liquid-free thermal control system. It does not require an external liquid chiller for normal thermal operation.
The MaxTC Power Plus can serve as a direct-contact alternative to LN2 systems, thermal streams, chillers, and environmental chambers in suitable semiconductor test applications.
Yes. The system supports remote operation through Ethernet TCP/IP with an RJ-45 connection. A 7-inch LCD touchscreen provides local system control.
The MaxTC Power Plus is suitable for:
- Automated test equipment (ATE)
- System-level testing (SLT)
- Bench testing
- Device characterization and validation
- High-reliability testing
- Failure analysis
- High-power IC testing
- OEM integration
- Thermal stream, chiller, and LN2 replacement
Axial / RH Thermal Head
Precise contact area for all type of DUT’s.
Customized Plunger From 2mm up to 80mm
Clip-on-Actuator
Pneumatic actuation ensures stable Socket
pressure and precise control
Boom Stand / Toggle Clamp
Soldered DUT’s
Simple setup