TOP COOL 1000
High-Power Thermal Control Unit
MD Thermal Control Units offer high efficiency and flexibility, supporting various package types and device sizes, whether socketed or soldered. Using advanced technology, they provide precise and consistent temperature control through direct contact with the thermal head’s tip.
The pneumatically driven thermal head ensures stable temperature regulation, excellent power handling, and precise control, making the units ideal for high-power devices, including AI – HPC & other extreme high-power devices.
The Mechanical Devices TOP COOL 1000 is an extreme high-power thermal control unit designed for precise temperature testing of high-power semiconductor devices. It provides direct-contact heating and cooling for AI, high-performance computing (HPC), and other power-intensive devices.
The TOP COOL 1000 operates across a temperature range of -70°C to +200°C, supporting cold, ambient, and high-temperature semiconductor testing.
The TOP COOL 1000 provides cooling performance of -40°C at 1000W Tc. It is engineered for devices with power dissipation of up to 1500 W, depending on the required case temperature and test conditions.
Yes. The TOP COOL 1000 is designed for temperature testing of extreme high-power devices, including AI processors, HPC devices, server components, and other advanced semiconductor packages.
The system uses a pneumatically actuated thermal head that makes direct contact with the device under test (DUT). This direct-contact method delivers heating or cooling to the device while maintaining stable pressure and precise temperature control.
The TOP COOL 1000 features a 75 mm thermal head with a large contact area for high-power semiconductor devices and packages. The system can be adapted for packages up to 119 mm, depending on the fixture and application configuration.
The TOP COOL 1000 provides temperature accuracy of ±0.2°C and temperature stability of 0.2°C, enabling repeatable thermal characterization, validation, and reliability testing.
The TOP COOL 1000 supports programmable temperature transition rates of up to 75°C per minute, helping reduce temperature cycling and device test time.
The system supports temperature sensors and DUT thermal-diode feedback. Its programmable thermal feedback loop enables temperature control based on the requirements of the device and test setup.
Yes. The TOP COOL 1000 can be configured for both socketed and soldered semiconductor devices. Customized fixtures, actuators, clamps, boom stands, and enclosures are available for different package and test-board configurations.
Yes. The TOP COOL 1000 is a self-contained, liquid-free thermal control unit. It can replace test solutions that depend on external chillers, thermal streams, or consumable liquid nitrogen.
The TOP COOL 1000 supports:
- Automated test equipment (ATE)
- System-level testing (SLT)
- Bench testing
- Device characterization and validation
- High-reliability testing
- OEM integrations
- High-power semiconductor testing
- Thermal stream, chiller, and LN2 replacement
Yes. The system supports remote operation through an Ethernet TCP/IP connection with an RJ-45 interface. It also includes a 7-inch touchscreen for local monitoring and control.
Available options include a pneumatic clip-on actuator, manual actuator, toggle clamp, boom stand, customized fixtures, and enclosures. The pneumatic configuration supports an actuation force of up to 350 kgf.
75mm Thermal Head
Large contact area for high-power devices and packages.
Packages up to 119mm
Clip-on-Actuator
Pneumatic actuation ensures stable pressure and precise control