Temperature Forcing Systems

For IC / Sensor Cycle Testing

Temperature Forcing Systems

For IC / Sensor Cycle Testing

Looking for Thermal Forcing Systems for evaluation and validation of IC devices?

Looking for Thermal Forcing Systems for evaluation and validation of IC devices?

We can support your engineering teams with temperature forcing systems to validate the design and to support failure analysis.

Mechanical Devices – Advanced Thermal Solutions is a global leader and innovator in developing, producing and supplying state-of-the-art thermal solutions, used primarily by semiconductor manufacturers to test their IC devices over extreme temperatures.

Mechanical Devices’ temperature control units perform fast, accurate, stable and cost effective solutions, using advanced and patented technology.

We can support your engineering teams with temperature forcing systems to validate the design and to support failure analysis.

Mechanical Devices – Advanced Thermal Solutions is a global leader and innovator in developing, producing and supplying state-of-the-art thermal solutions, used primarily by semiconductor manufacturers to test their IC devices over extreme temperatures.

Mechanical Devices’ temperature control units perform fast, accurate, stable and cost effective solutions, using advanced and patented technology.

As an integral part of the qualification and characterization process, engineers verify the sensor or IC is operational at different environmental conditions such as extreme temperature, to meet the Automotive, Airspace or other industries’ specifications.

With the industry standard temperature control units; Flex TC/ Max TC /Power Plus, Mechanical Devices is changing the way of testing and controlling the temperature, enabling semiconductor manufacturers to enhance their profitability and reliability by improving the efficiency and accuracy of their IC test processes.

Mechanical Devices’ Thermal Forcing systems are well integrated with automatic test equipment (ATE), SLT and Handlers, to simulate extreme temperature conditions at the lab, and later on at the test house facility.

As an integral part of the qualification and characterization process, engineers verify the sensor or IC is operational at different environmental conditions such as extreme temperature, to meet the Automotive, Airspace or other industries’ specifications.

With the industry standard temperature control units; Flex TC/ Max TC /Power Plus, Mechanical Devices is changing the way of testing and controlling the temperature, enabling semiconductor manufacturers to enhance their profitability and reliability by improving the efficiency and accuracy of their IC test processes.

Mechanical Devices’ Thermal Forcing systems are well integrated with automatic test equipment (ATE), SLT and Handlers, to simulate extreme temperature conditions at the lab, and later on at the test house facility.

 
Airstream Unit
MaxTC Power Plus
Range
-80°C to +225°C
(air)
-75°C to +200°C
(DUT case)
Cooling power
N/A
400W at -55°C
Accuracy
±2°C
±0.5°C
Temp.rate
N/A
75°C/min
Power
6.6 KW
3.2 KW
Noise
65 dBA equipment
+ airflow of 12 l/s
59 dBA
(air conditioner)
Weight
264 kg
65 kg
Dimensions
58x92x136 cm
55x45x30 cm
Compressed air
12 l/s
not required
No-Frost mode
Risk of frost
Frost free
Maintenance
required
not required
Remote control
N/A
Any test software
Price
High
±30% less
 
Airstream Unit
MaxTC Power Plus
Range
-80°C to +225°C
(air)
-75°C to +200°C
(DUT case)
Cooling power
N/A
400W at -55°C
Accuracy
±2°C
±0.5°C
Temp.rate
N/A
75°C/min
Power
6.6 KW
3.2 KW
Noise
65 dBA equipment
+ airflow of 12 l/s
59 dBA
(air conditioner)
Weight
264 kg
65 kg
Dimensions
58x92x136 cm
55x45x30 cm
Compressed air
12 l/s
not required
No-Frost mode
Risk of frost
Frost free
Maintenance
required
not required
Remote control
N/A
Any test software
Price
High
±30% less
 
Airstream Unit
Range
-80°C to +225°C
(air)
Cooling power
N/A
Accuracy
±2°C
Temp.rate
N/A
Power
6.6 KW
Noise
65 dBA equipment
+ airflow of 12 l/s
Weight
264 kg
Dimensions
58x92x136 cm
Compressed air
12 l/s
No-Frost mode
Risk of frost
Maintenance
required
Remote control
N/A
Price
High

 

 
MaxTC Power Plus
Range
-75°C to +200°C
(DUT case)
Cooling power
400W at -55°C
Accuracy
±0.5°C
Temp.rate
75°C/min
Power
3.2 KW
Noise
59 dBA
(air conditioner)
Weight
65 kg
Dimensions
55x45x30 cm
Compressed air
not required
No-Frost mode
Frost free
Maintenance
not required
Remote control
Any test software
Price
±30% less

Get More Details






Get More Details






Mechanical Devices Ltd Develops, Produces and Supplies state-of-the-art thermal solutions to the worldwide semiconductor industry for devices testing over temperature, whether in benchtop, ATE or SLT.

Mechanical Devices Ltd Develops, Produces and Supplies state-of-the-art thermal solutions to the worldwide semiconductor industry.

Innovative Thermal Solutions.

Test Your IC Device with Confidence without ever worrying about Temperature Requirements.

Temperature range options from -75°C to 200°C. Cooling power options can reach -40°C@400W.
Mechanical Devices Thermal Solutions Product Range

Innovative Thermal Solutions.

Test Your IC Device with Confidence without ever worrying about Temperature Requirements.

Temperature range options from -75°C to 200°C. Cooling power options can reach -40°C@400W.
Mechanical Devices Thermal Solutions Product Range

Among Our Clients

Among Our Clients

Let’s Talk / Meetup,
Contact Us Today!

Thermal Forcing Solution Has Never Been Easier

 

Let’s Talk / Meetup, Contact Us Today!

Thermal Forcing Solution Has Never Been Easier

 

Direct Contact TCU – Free of Fluid and Compressed Air.

MD Thermal control units were designed with high performance and flexibility in mind, allowing for customization to suit different package and interface variations.

The system allows for temperature forcing on any package. With advanced design and technology, MD units stimulate the DUT to the desired temperature with precision and consistency via direct contact with a thermal head’s plunger.

MD Thermal control units are self-contained, for real plug and play setup.