Interchangeable Device Plungers
Device Plungers are installed in the FlexTC thermal head by operators in the field and their selection determines the system performance. Device Plungers create the direct contact with the DUT for both temperature transferring via conduction and for applying push down forces on the DUT case. Device Plungers prices are cost effective and they are suitable for operation with different types of devices including; BGA, LGA, QFP, QFN, DIL, SOP, WLCSP, Bare Die and more.
Device Plunger Selection
Device plungers construction includes Mechanical-Devices cooling units, thermal sensors and communication boards. Device Plunger selection is application-oriented and determines the temperature range and the cooling power performances of the FlexTC.
|PN#||Temp Range||*Thermal Load (Watt)||DUT Dimensions|
|MDDT-485||-55C to +155C||21Watt @ -40C||>2X2mm|
*Thermal Load = Device Power Dissipation + Board Thermal Mass + Purge Influences