| FlexTC is the world´s most advanced Benchtop temperature forcing system. It was developed specifically for operations in semiconductor laboratories, and as such, it is designed to be as compact and quiet as possible (40Dba). FlexTC is a very robust system and it can operate 24/7 over long periods of time. The system is very reliable and today can be found in semiconductor laboratories worldwide.
This Product includes and protected by pending patents.
Proprietary of Mechanical-Devices Ltd 2012©
CE Certified and ISO 9001:2008 Certified.
The FlexTC benchtop temperature forcing system
Systems are easily carried between test benches
Temperature Accuracy< 0.2º C
Typical Transition Rates, 25ºC to -40ºC in, about 3 minutes
Temperature SensorTcase PT100 Thermisor/ K-type thermocouple
Thermal-Diode through the Ethernet port/
Thermal-Diode through the Analog port
Remote Interface Ports Ethernet (TCP / IP)
System Indicators and Fail-safesThermal head over temperature, Fans operation,
Cooling units operation
DUT Pressure Force2 - 100 Kg / Force
DUT Dimensions< 2 x 2 mm
DB Rating40 d BA
System Enclosure mm / (inch)L 420 (16.5) x W 320 (12.5) x H 220 (8.5)
System Weight22 KG
Thermal Head (mm)80mm Diameter
Thermal Head Hose2 meter (6.5ft )standard/ 3 meter (10ft) max.
Electrical100/115/120/220/230/240 VAC ±10%
50/60 Hz, single phase, 10A Max.
Purge0.2-0.6[BAR] Dry air/ Dry nitrogen
Ambient Temperature5ºC to 35 ºC (40 to 95ºF)
Ambient Humidity20% to 95% RH
|FlexTC operations are controlled by a full color 7" touch-screen with a menu driven graphical user interface.|
|DUT Interface Options|
|FlexTC creates a direct mechanical contact with the DUT using one of the following interface options:|
|For additional flexibility the FlexTC can be controlled remotely through an Ethernet communication port. Communication is established via a text file therefore every programming software on the market (LabVIEW, C++, MATLAB, Visual Basic, , Perl, etc´) can communicate with the FlexTC and control its operation.|
|The following options available for FlexTC systems:|
Used for purging dry air/ nitrogen to the PCB backside.
Guarantees a PCB backside environment that is free of frost and humidity.
Protects the device plunger while system is not in use.